| PART |
Description |
Maker |
| 1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| 1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
| PGM08XXX-XX PGM12XXX-XX |
IC Socket / Pin Grid Array
|
Aries Electronics
|
| SM2001 |
I.C. Socket, Pin Grid Array
|
Thomas & Betts
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| NP178-64401-1 NP178-64401-1-MF NP178-64401-2 NP178 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
| YPKG-BCCG-9287DC |
CCGA1152, 35.0 MM X 35.0 MM, 1.0 MM PITCH, 1152 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
| CA-PLCC20-Z-M-T-01 |
Carrier Adapter 20 Position PLCC ZIF Socket with test points to mini-grid array interface. Pin mapping is 1:1.
|
Ironwood Electronics.
|
